Tech · 26 May 2026
Huawei targets 1.4nm-class chips by 2031 without EUV
Huawei has revealed a new chip design approach called LogicFolding that it says can reach 1.4-nanometer-class performance by 2031 without access to advanced lithography machines. Rather than shrinking transistors, the technique stacks circuitry into vertical layers and reorganises how processing elements communicate to improve data flow. The company said it has mass-produced 381 chip models over six years under US export controls, with the first LogicFolding Kirin smartphone chips due this autumn.
Reported by CNBC · How we write briefs